Method of mounting passive electronic component on lead frame
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United States of America Patent
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Aug 1, 2017
Grant Date -
N/A
app pub date -
Dec 7, 2016
filing date -
Dec 7, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A packaged electronic device has first and second lead frame leads and a passive electronic component mounted, across a gap between the leads, on the top sides of the leads, using an adhesive. Facing lateral sides of the leads each include a recess that receives the adhesive. The recess promotes adhesion between the electronic component and the corresponding lead while limiting spread of the adhesive on the bottom side of the electronic component. The adhesive in the recesses promotes adhesion of the component to the leads by inhibiting cracking, and enhances inspection capability at the device backside.
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