Multiple bond via arrays of different wire heights on a same substrate

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United States of America Patent

PATENT NO 9728527
SERIAL NO

14925807

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Abstract

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An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.

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Patent Owner(s)

  • INVENSAS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Katkar, Rajesh San Jose, US 221 4423
Uzoh, Cyprian Emeka San Jose, US 329 9032

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