Metallization having high power compatibility and high electrical conductivity
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United States of America Patent
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Aug 8, 2017
Grant Date -
Jan 21, 2016
app pub date -
Sep 28, 2015
filing date -
Dec 2, 2009
priority date (Note) -
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Abstract
A metallization, for carrying current in an electrical component, includes a bottom layer overlying a substrate surface and includes titanium (Ti) or a titanium compound as main constituent. An upper layer overlies the bottom layer and includes copper (Cu) as main constituent. The bottom layer and the upper layer form a base layer. A top layer is in direct contact with the upper layer and includes aluminum (Al) as main constituent. The base layer further includes a middle layer, consisting of silver, that is arranged between the bottom layer and the upper layer.
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