Metal-ceramic substrate

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United States of America Patent

PATENT NO 9730310
SERIAL NO

14350661

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Abstract

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A metal-ceramic substrate having at least one ceramic layer (2), which is provided on a first surface side (2a) with at least one first metallization (3) and on a second surface side (2b), opposite from the first surface side (2a), with a second metallization (4), wherein the first metallization (3) is formed by a film or layer of copper or a copper alloy and is connected to the first surface side (2a) of the ceramic layer (2) with the aid of a “direct copper bonding” process. The second metallization (4) is formed by a layer of aluminum or an aluminum alloy.

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Patent Owner(s)

Patent OwnerAddress
ROGERS GERMANY GMBHAM STADTWALD 2 ESCHENBACH 92676

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Meyer, Andreas Wenzenbach, DE 162 997
Schmidt, Karsten Eschenbach, DE 40 181
Schulz-Harder, Jürgen Lauf, DE 16 77
Wehe, Christoph Wenzenbach, DE 5 10

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