System and method for defect analysis of a substrate

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United States of America Patent

PATENT NO 9734572
SERIAL NO

14611938

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Abstract

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The present disclosure provides a method including providing a first image and a second image. The first image is of a substrate having a defect and the second image is of a reference substrate. A difference between the first image and the second image is determined. A simulation model is used to generate a simulation curve corresponding to the difference and the substrate dispositioned based on the simulation curve. In another embodiment, the scan of a substrate is used to generate a statistical process control chart.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Ming-Yi Xin Zhu Shi, TW 25 188
Liao, Chi-Hung Sanchong, TW 140 223
Tien, Yao-Wei Hualien, TW 1 6

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