SEMICONDUCTOR DEVICE
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United States of America Patent
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Aug 15, 2017
Grant Date -
Aug 17, 2017
app pub date -
Jan 30, 2017
filing date -
Feb 16, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a semiconductor device that is configured to contain a sealing layer for sealing a semiconductor element supported on a base, the sealing layer being configured to have a nanocomposite structure that comprises a large number of nanometer-sized (1 μm or smaller) insulating nanoparticles composed of SiO2, and an amorphous silica matrix that fills up the space around the insulating nanoparticles without voids and gaps.
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