Conductive pads forming method

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United States of America Patent

PATENT NO 9735119
SERIAL NO

15219265

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Abstract

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In some embodiments, the present disclosure provides a conductive pads forming method. The conductive pads forming method may include providing a contact pad or a test pad electrically connected to a semiconductor component; and forming the conductive pads electrically connected to the contact pad or the test pad through the conductive routes, respectively.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Tzung-Han Taipei, TW 134 588

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