Optical sensor package and optical sensor assembly

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United States of America Patent

PATENT NO 9735135
SERIAL NO

14560192

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Abstract

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There is provided an optical sensor package including a semiconductor base layer. A first surface of the semiconductor base layer is formed with a pixel array, a plurality of solder balls and an optical component such that when the optical sensor package is assembled with a substrate, the optical component is accommodated in an accommodation throughhole of the substrate so as to reduce the total thickness.

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Patent Owner(s)

Patent OwnerAddress
PIXART IMAGING (PENANG) SDN BHDPHASE III BAYAN LEPAS FREE INDUSTRIAL ZONE PENANG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chong, Yik-Leong Penang, MY 2 17
Lee, Hun-Kwang Penang, MY 7 7
Lee, Sai-Mun Penang, MY 37 92

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