Chemical mechanical polishing pad, polishing layer analyzer and method

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United States of America Patent

PATENT NO 9737971
SERIAL NO

14993882

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Abstract

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A chemical mechanical polishing pad, polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.

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Patent Owner(s)

  • DOW GLOBAL TECHNOLOGIES LLC;ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Acholla, Francis V New Castle, US 6 22
Chang, Scott Taipei, TW 6 33
Chiang, Leo H Pearland, US 3 3
Chin, Swee-Teng Pearland, US 3 3
Gazze, Mark Lincoln University, US 3 3
Heeschen, William A Midland, US 8 59
Tate, James David Lake Jackson, US 3 3
Tsai, Jeff Chunan, TW 7 90
Wank, Andrew Avondale, US 12 37

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