Probe device

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United States of America Patent

PATENT NO 9739828
SERIAL NO

14779870

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Abstract

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A probe device, for performing an electrical test of a semiconductor device formed on a semiconductor wafer, includes a mounting table on which the semiconductor wafer is mounted, a driving mechanism configured to bring a probe into contact with an electrode of the semiconductor device mounted on the mounting table, and a temperature control mechanism configured to control a temperature of the mounting table. The mounting table includes a disk-shaped first electrode, a disk-shaped second electrode, and a disk-shaped insulating plate interposed between the first electrode and the second electrode. The first electrode, the second electrode and the insulating plate are fixed to each other at a fixing part provided at their respective centers, and are locked to be movable in a diametric direction at a locking part provided at an outer side of the fixing part in the diametric direction.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-66325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hatta, Masataka Yamanashi, JP 13 621

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