Bump structures, semiconductor device and semiconductor device package having the same
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United States of America Patent
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Aug 22, 2017
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app pub date -
Jan 16, 2015
filing date -
Jan 16, 2015
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Abstract
The present disclosure relates to bump structures and a semiconductor device and semiconductor device package having the same. The semiconductor device includes a body, at least one conductive metal pad and at least one metal pillar. The body includes a first surface. The at least one conductive metal pad is disposed on the first surface. Each metal pillar is formed on a corresponding conductive metal pad. Each metal pillar has a concave side wall and a convex side wall opposite the first concave side wall, and the concave side wall and the convex side wall are orthogonal to the corresponding conductive metal pad.
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