Thin light emitting diode and fabrication method

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United States of America Patent

PATENT NO 9741897
SERIAL NO

14826739

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Abstract

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A method for fabrication a light emitting diode (LED) includes forming alternating material layers on an LED structure, formed on a substrate, to form a reflector on a back side opposite the substrate. A handle substrate is adhered to a stressor layer deposited on the reflector. The LED structure is separated from the substrate using a spalling process to expose a front side of the LED structure.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bedell, Stephen W Wappingers Falls, US 409 5517
Hekmatshoartabari, Bahman White Plains, US 389 1807
Sadana, Devendra K Pleasantville, US 897 9891
Shahrjerdi, Davood White Plains, US 247 4175

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