Resin composition for laser direct structuring, resin-molded article, and method for manufacturing molded article with plated layer
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United States of America Patent
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Aug 29, 2017
Grant Date -
Jun 12, 2014
app pub date -
Jun 5, 2013
filing date -
Jun 6, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Provided is a resin composition excellent in mechanical strength while maintaining LDS activity. The resin composition for laser direct structuring comprises, relative to 100 parts by weight of a polycarbonate resin component, 10 to 100 parts by weight of a glass filler and 1 to 30 parts by weight of a laser direct structuring additive, wherein the polycarbonate resin component consists of 80 to 30% by weight of a polycarbonate resin and 20 to 70% by weight of a styrene-based resin, or consists of a polycarbonate; and the laser direct structuring additive comprises antimony and tin.
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International Classification(s)
- B41M:PRINTING, DUPLICATING, MARKING, OR COPYING PROCESS....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- H01Q:AERIALS
- B41C:PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF P....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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