Cylindrical sputtering target material
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United States of America Patent
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Aug 29, 2017
Grant Date -
Jul 14, 2016
app pub date -
Feb 20, 2015
filing date -
Apr 22, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a cylindrical sputtering target material formed of copper or a copper alloy, in which an average value of the special grain boundary length ratios LσN/LN which are measured with respect to the outer peripheral surfaces of both end portions and the outer peripheral surface of the center portion in an axis O direction is set to be equal to or greater than 0.5, and each measured value is in a range of ±20% with respect to the average value of the special grain boundary length ratios LσN/LN, and the total amount of Si and C which are impurity elements is equal to or smaller than 10 mass ppm and the amount of O is equal to or smaller than 50 mass ppm.
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