Semiconductor package structure including die and substrate electrically connected through conductive segments
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 29, 2017
Issued Date -
N/A
app pub date -
Sep 15, 2014
filing date -
Sep 15, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present disclosure relates to a semiconductor package structure, including a die and a package substrate. The die includes a semiconductor substrate, multiple interconnect metal layers, and at least one inter-level dielectric disposed between ones of the interconnect metal layers. Each inter-level dielectric is formed of a low k material. An outermost interconnect metal layer has multiple first conductive segments exposed from a surface of the inter-level dielectric. The package substrate includes a substrate body and multiple second conductive segments exposed from a surface of the substrate body. The second conductive segments are electrically connected to the first conductive segments.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully