Nonvolatile semiconductor memory device and manufacturing method thereof

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United States of America Patent

PATENT NO 9748260
SERIAL NO

14724853

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Abstract

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A nonvolatile semiconductor memory device that have a new structure are provided, in which memory cells are laminated in a three dimensional state so that the chip area may be reduced. The nonvolatile semiconductor memory device of the present invention is a nonvolatile semiconductor memory device that has a plurality of the memory strings, in which a plurality of electrically programmable memory cells is connected in series. The memory strings comprise a pillar shaped semiconductor; a first insulation film formed around the pillar shaped semiconductor; a charge storage layer formed around the first insulation film; the second insulation film formed around the charge storage layer; and first or nth electrodes formed around the second insulation film (n is natural number more than 1). The first or nth electrodes of the memory strings and the other first or nth electrodes of the memory strings are respectively the first or nth conductor layers that are spread in a two dimensional state.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aochi, Hideaki Kawasaki, JP 245 11488
Fukuzumi, Yoshiaki Yokohama, JP 334 10815
Katsumata, Ryota Yokohama, JP 205 10803
Kidoh, Masaru Kawasaki, JP 143 9621
Kito, Masaru Yokohama, JP 233 11022
Matsuoka, Yasuyuki Yokohama, JP 54 4500
Nitayama, Akihiro Yokohama, JP 56 3148
Sato, Mitsuru Yokohama, JP 275 5351
Tanaka, Hiroyasu Tokyo, JP 249 10224

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