Polyamide resin composition and molded article

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United States of America Patent

PATENT NO 9752006
APP PUB NO 20160177049A1
SERIAL NO

14972847

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Abstract

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A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and a secondary amine compound (D).

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI KABUSHIKI KAISHA1-1-2 YURAKUCHO CHIYODA-KU TOKYO 100-0006

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sakuma, Teruaki Tokyo, JP 11 29
Terada, Kazunori Tokyo, JP 19 123

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