Plasmonic nano-lithography based on attenuated total reflection

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United States of America Patent

PATENT NO 9754794
APP PUB NO 20150348793A1
SERIAL NO

14425326

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Techniques related to semiconductor fabrication are generally described herein. An example fabrication method may include coupling, by a lithographic equipment, a surface of a planar waveguide structure with a first surface of a photolithographic mask. Some example methods may also include directing, by the lithographic equipment, a lithography light beam into the planar waveguide structure, causing a surface plasmon being emitted from the surface of the planar waveguide structure when the lithography light beam is reflected by internal surfaces of the planar waveguide structure, effectuating an attenuated total reflection. Some example methods may further include directing, by the lithographic equipment, an evanescent wave caused by the surface plasmon through the photolithographic mask, wherein the evanescent wave has a sub-diffraction characteristic and is used as a photolithographic light source.

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Patent Owner(s)

Patent OwnerAddress
SHANGHAI JIAO TONG UNIVERSITYNO 800 DONGCHUAN ROAD MINHANG DISTRICT SHANGHAI 200240 200240

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Qingkang Shanghai, CN 3 2

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