HYBRID METAL INTERCONNECTS WITH A BAMBOO GRAIN MICROSTRUCTURE
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United States of America Patent
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Sep 5, 2017
Grant Date -
Sep 7, 2017
app pub date -
Mar 4, 2016
filing date -
Mar 4, 2016
priority date (Note) -
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Abstract
A method of forming an interconnect with a bamboo grain microstructure. The method includes forming a conductive filler layer in a trench of an insulating layer to a predetermined depth such that an aspect ratio of a top portion of the trench is reduced to a threshold level, depositing a metal layer over the conductive filler layer in the top portion of the trench, the metal layer having a plurality of small grains, and annealing the metal layer to provide a bamboo grain microstructure having larger grains than grain boundaries of the plurality of small grains.
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