Double plated conductive pillar package substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9754906
SERIAL NO

14750880

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Abstract

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The present disclosure relates to a package substrate. The package substrate includes a patterned conductive layer and conductive pillars. Each of the conductive pillars includes a first portion and a second portion, where the first portion contacts the patterned conductive layer at one end of the first portion, and the second portion is adjacent to another end of the first portion. A thickness of the first portion is greater than a thickness of the second portion. Side surfaces of the first portion are substantially coplanar to side surfaces of the second portion.

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Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Chih-Cheng Kaohsiung, TW 100 204
Tsai, Li-Chuan Kaohsiung, TW 10 59

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