Package for housing electronic component and electronic device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9756731
APP PUB NO 20150334845A1
SERIAL NO

14758334

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A package for housing an electronic component, which is provided with: a substrate part that comprises an insulating substrate, which is formed of a ceramic sintered body and comprises a recess portion, and a wiring conductor which is provided on the insulating substrate; and a metal portion which is formed of a sintered body of a getter metal material and is directly bonded to the recess portion.

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First Claim

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Patent Owner(s)

  • KYOCERA MITA CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Niino, Noritaka Kirishima, JP 20 42

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