Resistance assembly for mobile device and manufacturing method thereof
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United States of America Patent
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Sep 12, 2017
Grant Date -
Oct 29, 2015
app pub date -
Apr 24, 2015
filing date -
Apr 25, 2014
priority date (Note) -
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Abstract
A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an embodiment of the present invention includes: a substrate having a circuit formed thereon; first to third pads laminated and separated from one another on the substrate; first to third terminals connected to the first to third pads, respectively; and first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit.
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