Systems and methods for mechanical and electrical package substrate issue mitigation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 12, 2017
Grant Date -
Mar 24, 2016
app pub date -
Dec 7, 2015
filing date -
Jul 12, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Systems and methods are provided for an integrated circuit package. A plurality of electrical contacts are configured to provide a structure for electrically connecting the integrated circuit package to a printed circuit board. A package substrate includes at least one patterned metallic layer formed to electrically interconnect I/O contacts of an integrated circuit to the plurality of electrical contacts, and at least one generally uniform metallic layer having a plurality of voids that are respectively situated in axial alignment with corresponding ones of the electrical contacts, and one or more dielectric layers disposed between the plurality of electrical contacts and the metallic layers. Further, the package substrate includes a plurality of metallic elements disposed within the plurality of voids and electrically isolated from the generally uniform metallic layer, the metallic elements configured to reduce a physical size of respective voids without electrically contacting the generally uniform metallic layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully