SEMICONDUCTOR DEVICE
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United States of America Patent
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app pub date -
Nov 13, 2015
filing date -
Nov 13, 2015
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Abstract
A semiconductor device is provided with: a semiconductor integrated circuit having a bump mounting surface; and a thin-film capacitor portion connected to the bump mounting surface via a bump. The semiconductor integrated circuit includes a first power supply pad, and a second power supply pad. The thin-film capacitor portion includes a first electrode layer connected to the first power supply pad, a second electrode layer connected to the second power supply pad, and a dielectric layer formed between the first electrode layer and the second electrode layer. The semiconductor device is provided with an electric power supply path configured to supply electric power to the semiconductor integrated circuit, and a thin plate-shaped metal resistor portion provided in the electric power supply path and made from a metal based high-resistance material having a volume resistivity higher than a volume resistivity of the first electrode layer and the second electrode layer.
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