Power semiconductor module and composite module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9761567
APP PUB NO 20160254255A1
SERIAL NO

15150938

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A power semiconductor module includes a wiring member that electrically connects a front surface electrode of a semiconductor element and a circuit board of an insulating substrate in a housing. A resin provided in the housing covers the wiring member, and has a height in the vicinity of the wiring member. A cover covering the periphery of external terminals is provided between the resin and a first lid in the housing. A second lid is provided further outside the first lid in an aperture portion of the housing, and the space between the second lid and the first lid is filled with another resin.

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First Claim

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Patent Owner(s)

  • FUJI ELECTRIC CO. LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hori, Motohito Matsumoto, JP 34 125
Ikeda, Yoshinari Matsumoto, JP 63 367

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