Stud bump structure for semiconductor package assemblies

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United States of America Patent

PATENT NO 9768137
SERIAL NO

13460412

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Abstract

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A semiconductor package structure comprises a substrate, a die bonded to the substrate, and one or more stud bump structures connecting the die to the substrate, wherein each of the stud bump structures having a stud bump and a solder ball encapsulating the stud bump to enhance thermal dissipation and reduce high stress concentrations in the semiconductor package structure.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Cheng-Ting Taichung, TW 51 444
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Lin, Chih-Wei Xinfeng Township, TW 359 5145
Lin, Hsiu-Jen Zhubei, TW 172 1408
Liu, Chung-Shi Hsinchu, TW 824 11367

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