Interposers

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United States of America Patent

PATENT NO 9769923
SERIAL NO

15380172

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Abstract

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Interposer circuitry (130) is formed on a possibly sacrificial substrate (210) from a porous core (130′) covered by a conductive coating (130″) which increases electrical conductance. The core is printed from nanoparticle ink. Then a support (120S) is formed, e.g. by molding, to mechanically stabilize the circuitry. A magnetic field can be used to stabilize the circuitry while the circuitry or the support are being formed. Other features are also provided.

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Patent Owner(s)

  • INVENSAS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Bong-Sub Mountain View, US 5 80
Mirkarimi, Laura Wills Sunol, US 77 2355
Sitaram, Arkalgud R Cupertino, US 62 1385
Uzoh, Cyprian Emeka San Jose, US 329 8954
Wang, Liang Milpitas, US 567 4722
Woychik, Charles G San Jose, US 106 2126

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