Electronic element and manufacturing method

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United States of America Patent

PATENT NO 9773746
SERIAL NO

15190147

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Abstract

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An electronic element for an electronic apparatus includes a substrate; a bump, disposed on the substrate for electrically connecting the electronic apparatus; and at least one under bump metal layer, disposed between the bump and the substrate for the bump to be attached to the substrate; wherein the UBM layer forms a breach structure.

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Patent Owner(s)

  • SITRONIX TECHNOLOGY CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Po-Chi Hsinchu County, TW 9 6
Tseng, Kuo-Wei Hsinchu County, TW 20 41

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