Semiconductor device with magnetically aligned chips and method for fabricating the same
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United States of America Patent
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Sep 26, 2017
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Sep 14, 2016
filing date -
Dec 3, 2015
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Abstract
A semiconductor device includes a first semiconductor chip adjacent a second semiconductor chip. The first semiconductor chip includes a first surface and a second surface. The second semiconductor chip includes a third surface and a fourth surface. The third surface faces the second surface. A first through-electrode and a second through-electrode are between the first and second surfaces. A third through-electrode is between the third surface and the fourth surface and is connected to the first through-electrode. A fourth through-electrode is between the third surface and the fourth surface and is connected to the second through-electrode. An end of the first through-electrode has a first magnetic polarity on the second surface, and an end of the second through-electrode has a second magnetic polarity opposite to the first magnetic polarity on the second surface.
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