Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materials
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United States of America Patent
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Oct 3, 2017
Grant Date -
Sep 4, 2014
app pub date -
Mar 19, 2012
filing date -
Apr 5, 2011
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Abstract
The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the invention, the method for manufacturing an electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region.
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