Chip type fuse
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United States of America Patent
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Oct 3, 2017
Grant Date -
Dec 24, 2015
app pub date -
Jun 15, 2015
filing date -
Jun 19, 2014
priority date (Note) -
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Abstract
A chip type fuse excellent in resistance to climate conditions, where the fuse is able to operate stably under high temperature and high humidity environments. The fuse includes an insulative substrate; an under-glass layer formed on the insulative substrate; a fuse element formed on the under-glass layer; a pair of electrodes formed at both end sides of the fuse element; and an over-glass layer covering at least a fusing section of the fuse element; wherein the fuse element includes a layer where a first metal layer and a second metal layer are piled up, and a barrier layer consisting of a third metal layer, which covers the first metal layer and the second metal layer with a width that is wider than the width of the first metal layer and the second metal layer. The third metal layer overwraps the second metal layer and the first metal layer.
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