Apparatus for liquid treatment of wafer shaped articles

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9779979
APP PUB NO 20150243543A1
SERIAL NO

14188230

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Abstract

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An apparatus for processing wafer-shaped articles comprises a spin chuck adapted to hold and spin a wafer-shaped article of a predetermined diameter during a processing operation. A liquid collector surrounds the spin chuck, and comprises a first inner surface. The first inner surface comprises a first conductive material. The collector further comprises a first conductive pathway for grounding the first conductive material.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH AGSEZ-STRASSE 1 9500 VILLACH 9500

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pliska, Milan Villach, AT 6 16
Schwarzenbacher, Reinhold Reisseck, AT 9 21

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