Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module

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United States of America Patent

PATENT NO 9780011
SERIAL NO

14127476

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Abstract

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To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Ag powder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-μm equivalent circle average particle diameter by 0.5 to 5.0 mass %, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder≧active metal hydride powder>Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 μm, d50 of 10 to 35 μm, and d90 of 30 to 50 μm, and in the frequency distribution, a peak of the distribution existing between d50 and d90.

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Patent Owner(s)

Patent OwnerAddress
PROTERIAL LTD6-36 TOYOSU 5-CHOME KOTO-KU TOKYO 1350061

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujita, Suguru Kitakyushu, JP 92 1651
Imamura, Hisayuki Kitakyushu, JP 13 189
Watanabe, Junichi Kitakyushu, JP 126 1794

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