Using interrupted through-silicon-vias in integrated circuits adapted for stacking

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United States of America Patent

PATENT NO 9780073
APP PUB NO 20160099234A1
SERIAL NO

14886190

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Abstract

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In an integrated circuit (IC) adapted for use in a stack of interconnected ICs, interrupted through-silicon-vias (TSVs) are provided in addition to uninterrupted TSVs. The interrupted TSVs provide signal paths other than common parallel paths between the ICs of the stack. This permits IC identification schemes and other functionalities to be implemented using TSVs, without requiring angular rotation of alternate ICs of the stack.

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Patent Owner(s)

  • CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gillingham, Peter B Ottawa, CA 108 2490

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