Long-term packaging for the protection of implant electronics

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United States of America Patent

PATENT NO 9781842
APP PUB NO 20150036302A1
SERIAL NO

14142180

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Abstract

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The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.

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Patent Owner(s)

Patent OwnerAddress
CALIFORNIA INSTITUTE OF TECHNOLOGY1200 E CALIFORNIA BLVD MC 6-32 PASADENA CA 91125

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Han-Chieh Pasadena, US 39 129
Tai, Yu-Chong Pasadena, US 251 6248

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