Aqueous compositions of low abrasive silica particles
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 10, 2017
Issued Date -
N/A
app pub date -
Oct 19, 2016
filing date -
Oct 19, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention provides aqueous chemical mechanical planarization (CMP) polishing compositions having a pH ranging from 2.5 to 5.3 and comprising a mixture of spherical colloidal silica particles and from 30 to 99 wt. %, based on the total weight of silica solids in the aqueous CMP polishing composition, of elongated, bent or nodular silica particles wherein the colloidal and elongated, bent or nodular silica particles differ from each other in weight average particle size (CPS) less than 20 nm, wherein at least one of the spherical colloidal silica particles and the elongated, bent or nodular silica particles contains one or more cationic nitrogen atoms. The present invention further provides methods of using the compositions in high downforce CMP polishing applications.
First Claim
Family
International Classification(s)
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....
- C01B:NON-METALLIC ELEMENTS; COMPOUNDS THEREOF
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C09G:POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; S....
- G09G:ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING....
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully