Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition

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United States of America Patent

PATENT NO 9822294
APP PUB NO 20140349105A1
SERIAL NO

14290219

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Abstract

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To provide a composition for a three-dimensional integrated circuit capable of forming a filling interlayer excellent in thermal conductivity also in a thickness direction, using agglomerated boron nitride particles excellent in the isotropy of thermal conductivity, disintegration resistance and kneading property with a resin.

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Patent Owner(s)

  • MITSUBISHI CHEMICAL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Mari Yokohama, JP 16 562
Ikemoto, Makoto Kitakyushu, JP 13 135
Kawase, Yasuhiro Kitakyushu, JP 39 273
Kiritani, Hideki Chiyoda-ku, JP 5 52
Matsushita, Yasunori Yokkaichi, JP 6 73
Murase, Tomohide Yokohama, JP 6 33
Yamazaki, Masanori Yokohama, JP 39 396

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