Apparatus and method

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United States of America Patent

PATENT NO 9783887
SERIAL NO

13816870

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Abstract

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The invention is related to an apparatus and a method for processing a surface of a substrate by exposing the surface of the substrate to alternating surface reactions of at least a first starting material and a second starting material according to the principles of atomic layer deposition method. According to the invention a first starting material is fed on the surface of the substrate locally by means of a source by moving the source in relation to the substrate, and the surface of the substrate processed with the first starting material is exposed to a second starting material present in the atmosphere surrounding the source.

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Patent Owner(s)

Patent OwnerAddress
HERVANNAN SAUNA OYOLARINLUOMA 9 ESPOO 02200

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sneck, Sami Vantaa, FI 11 625
Soininen, Pekka Helsinki, FI 69 3092

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