Nonwoven joint tape having low moisture expansion properties and method for using same
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United States of America Patent
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Oct 10, 2017
Grant Date -
Sep 22, 2016
app pub date -
May 26, 2016
filing date -
Dec 12, 2006
priority date (Note) -
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Abstract
The invention is directed to a joint tape for finishing a joint between boards comprising a nonwoven substrate that does not swell substantially in the presence of water. The invention further provides a method of finishing a joint between boards comprising (i) applying a joint tape of the invention to a joint between boards by embedding the joint tape in a first coat of joint compound, (ii) applying a second coat of joint compound over the tape, wherein step (ii) is carried out before the joint tape and joint compound applied in step (i) have substantially dried, and optionally (iii) applying a third fill or finish coat of joint compound over the tape, wherein step (iii) is carried out before the joint tape and second coat have substantially dried.
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