Solid electrolytic capacitor package structure and method of manufacturing the same

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United States of America Patent

PATENT NO 9786441
SERIAL NO

15147120

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Abstract

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The instant disclosure provides a solid electrolytic capacitor package structure and method of manufacturing the same. The solid electrolytic capacitor package structure includes a capacitor assembly, at least one electrode pin and a package body enclosing the capacitor assembly and the electrode pin. The electrode pin includes an embedded portion enclosed by the package body and an exposed portion positioned outside the package body. The method of manufacturing the solid electrolytic capacitor package structure includes a protection step including forming a protecting film on the exposed portion; a coating step including depositing a nanomaterial on the solid electrolytic capacitor package structure to form a nanofilm, wherein the nanomaterial penetrates into defects of the solid electrolytic capacitor package structure; and a deprotection step including removing the protecting film. The instant disclosure provides improved air-tight and water-tight properties of the solid electrolytic capacitor package structure, thereby increasing the lifetime thereof.

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Patent Owner(s)

Patent OwnerAddress
APAQ TECHNOLOGY CO LTDNO 11 KEYI ST NEIGHBORHOOD 11 GONGYI JHUNAN TOWNSHIP MIAOLI COUNTY 350

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Chun-Chia Tainan County, TW 26 111
Kao, Liang-Min Yunlin County, TW 1 4
Lin, Ching-Feng Hsinchu County, TW 51 550

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