Semiconductor package with sidewall-protected RDL interposer

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United States of America Patent

PATENT NO 9786514
SERIAL NO

15296058

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Abstract

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A semiconductor package includes a redistribution layer (RDL) interposer having a first side, a second side opposite to the first side, and a vertical sidewall extending between the first side and the second side; at least one semiconductor die mounted on the first side of the RDL interposer; a molding compound disposed on the first side and covering the at least one semiconductor die and the vertical sidewall of the RDL interposer; and a plurality of solder bumps or solder balls mounted on the second side of the RDL interposer.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shih, Shing-Yih New Taipei, TW 185 743
Wu, Tieh-Chiang Taoyuan, TW 73 251

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