Method and apparatus for substrate rinsing and drying

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United States of America Patent

PATENT NO 9786523
SERIAL NO

14211303

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Abstract

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A method and apparatus are disclosed for optimizing a rinsing and drying process in semiconductor manufacturing. The optimization seeks to maximize processing throughput while maintaining low defect counts and high device yields, and utilizes simulation and experimental data to set the optimal process parameters for the rinsing and drying process. Improved methods of rinse liquid and purge gas nozzle movement are also disclosed.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Carcasi, Michael A Austin, US 27 669
Fonseca, Carlos A Austin, US 36 359

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