Power semiconductor package device having locking mechanism, and preparation method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9786583
APP PUB NO 20160379917A1
SERIAL NO

15169623

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Abstract

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A power semiconductor package device and a method of preparation the device are disclosed. The package device includes a die paddle, a first pin, a second pin, and a semiconductor chip attached to the die paddle. A first electrode, a second electrode and a third electrode of the semiconductor chip are connected to the first pin, the second pin and the die paddle respectively. A plastic package body covers the semiconductor chip, the die paddle, the first pin and the second pin. The first pin and the second pin are located near two adjacent corners of the plastic package body. The bottom surface and two side surfaces of each of the first pin and the second pin are exposed from the plastic package body. Locking mechanisms are constructed to prevent the first pin and the second pin from falling off the power semiconductor package device during a manufacturing cutting process. Portions of the first pin, portions of the second pin, and portions of the plastic package body can be cut off. Therefore, the size of the power semiconductor package device is reduced.

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Patent Owner(s)

  • ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gong, De Mei Shanghai, CN 2 4
Ho, Yueh-Se Sunnyvale, US 113 2132
Lu, Jun San Jose, US 498 15252
Xue, Yan Xun Los Gatos, US 99 711
Yilmaz, Hamza Gilroy, US 291 4987

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