Method for manufacturing printed circuit board with etching process to partially remove conductive layer
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United States of America Patent
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Oct 10, 2017
Issued Date -
N/A
app pub date -
Sep 9, 2015
filing date -
May 27, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure relates to a method for manufacturing a printed circuit board. The method includes the steps as follows. First, a substrate including a base layer and a copper foil layer on a surface of the base layer is provided. Second, a conductive layer is formed on portions of the copper foil layer. Third, portions of the copper foil layer exposed from the conductive layer are removed by an etching process, and the conductive layer is thinner by the etching process. The reserved portions of the copper foil layer and the conductive layer form a conductive pattern to obtain a printed circuit board without plating wires. A printed circuit board without plating wires made by the above method is also provided.
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