Manufacturing method of multilayer printed wiring board
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United States of America Patent
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Oct 10, 2017
Grant Date -
Oct 6, 2016
app pub date -
Mar 26, 2014
filing date -
Sep 20, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A wiring substrate is manufactured by attaching an adhesive protective film to a metal-foiled laminate sheet, forming bottomed via holes by partially removing the film and an insulating film, filling conductive pastes into the holes, and peeling the film. A wiring substrate is manufactured by forming an adhesive protective layer so as to cover a patterned metal foil on a metal-foiled laminate sheet, forming bottomed step via holes by partially removing the layer and an insulating film, filling conductive pastes into the holes, and peeling off a protective film. The wiring substrate and the second wiring substrate are laminated in such a way that protruding parts of the pastes come into contact with respective protruding parts of the pastes.
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Family
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Cited Art Landscape
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