Photocurable adhesive composition
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United States of America Patent
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Oct 17, 2017
Grant Date -
Jun 18, 2015
app pub date -
Feb 27, 2015
filing date -
Oct 4, 2008
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Provided is a method of manufacturing a liquid crystal panel employing a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends without forming a gap therebetween. The photocurable adhesive composition of the inventive method comprises (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight-average molecular weight of 20,000 to 100,000, (B) 5 parts to 70 parts by mass of a phenoxy resin, and (C) 0.1 parts to 10 parts by mass of a photopolymerization initiator. The uncured composition has a loss tangent (loss modulus/storage modulus) of less than 1 at 25° C. and the temperature at which the loss tangent of the uncured composition reaches 1 or more is 80° C. or less.
First Claim
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International Classification(s)
- C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
- B05D:PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- G02F:DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF ....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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