Determining three-dimensional information from projections or placement of two-dimensional patterns
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United States of America Patent
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Oct 17, 2017
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N/A
app pub date -
May 12, 2015
filing date -
May 27, 2014
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Abstract
Embodiments of a shape measurement system and related methods are disclosed. In some embodiments, the system places a two-dimensional initial pattern, which can be implemented as a standalone molding or can be attached to a light source or printed on an outfit, onto a surface of a three-dimensional object. The system captures a transformed version of the initial pattern in two dimensions that is distorted due to the varying depth of the surface. The system then analyzes the transformed pattern and derives three-dimensional information regarding the target object. The analysis, which can incorporate a calibration process, can rely on the projection nature of the light source, the isomorphism/non-isomorphism of the initial pattern, and other factors.
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