Magnet placement for integrated sensor packages

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United States of America Patent

PATENT NO 9791470
SERIAL NO

14141759

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Abstract

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Magnet placement is described for integrated circuit packages. In one example, a terminal is applied to a magnet. The magnet is then placed on a top layer of a substrate with solder between the terminal and the top layer, and the solder is reflowed to attach the magnet to the substrate.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eid, Feras Chandler, US 266 931
Haney, Sarah Cary, US 16 122
Lee, Kyu Oh Chandler, US 56 227
Oster, Sasha N Chandler, US 100 394

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