Printed wiring board assembly, electrical device, and method for assembling printed wiring board assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9793189
APP PUB NO 20170053850A1
SERIAL NO

15238062

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A printed wiring board assembly includes a first board including a first surface; a second board including a second surface and facing the first surface; a plurality of first electrodes formed on a bottom surface of a recess formed in one of the first and the second surfaces; a plurality of second electrodes formed on the one of the first surface and the second surface and positioned outside the recess; a plurality of first solders each coupled to a respective one of the plurality of first electrodes; and a plurality of second solders each coupled to a respective one of the plurality of second electrodes, wherein the plurality of first electrodes are formed at a larger pitch than a pitch at which the plurality of second electrodes are formed, and a size of each the plurality of first solders is larger than a size of the plurality of second solders.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
FUJITSU LIMITEDKAWASAKI18047

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Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 2014/0085,823 IMMERSION-COOLING OF SELECTED ELECTRONIC COMPONENT(S) MOUNTED TO PRINTED CIRCUIT BOARD 7 2012
 
Other [Check patent profile for assignment information] (1)
* 2002/0030,972 Heatsink apparatus for de-coupling clamping forces on an integrated circuit package 4 2001
 
POLARIS INNOVATIONS LIMITED (1)
* 2007/0139,897 Circuit board arrangement including heat dissipater 5 2005
 
Netlist, Inc. (1)
* 2011/0110,047 MODULE HAVING AT LEAST TWO SURFACES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN 11 2010
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
* 2006/0133,043 Heat spreader with multiple stacked printed circuit boards 5 2004
 
Whelen Engineering Company, Inc. (1)
* 2015/0201,486 Stacked Heatsink Assembly 1 2015
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (1)
* 2009/0086,431 CIRCUIT DEVICE, CIRCUIT MODULE, AND OUTDOOR UNIT 14 2008
 
INCEP TECHNOLOGIES, INC. (1)
* 2002/0008,963 Inter-circuit encapsulated packaging 72 2001
 
THOMSON LICENSING (1)
* 2013/0063,895 SET-TOP BOX HAVING DISSIPATING THERMAL LOADS 6 2011
 
SAMSUNG ELECTRONICS CO., LTD. (2)
* 2008/0055,863 Method of manufacturing as component embedded printed circuit board 4 2007
* 2013/0135,823 SEMICONDUCTOR PACKAGES USABLE WITH A MOBILE DEVICE 3 2012
 
HONEYWELL INTERNATIONAL INC. (1)
* 2005/0024,834 Heatsinking electronic devices 21 2003
 
RAMBUS INC. (2)
* 2009/0316,366 System and Method for Dissipating Heat From A Semiconductor Module 4 2009
* 2010/0315,787 System and Method for Dissipating Heat from Semiconductor Devices 14 2010
 
USSI, LLC d/b/a NARTRON (1)
* 2015/0098,192 MOTOR CONTROL DEVICE 1 2013
 
ALLEN-BRADLEY COMPANY, LLC (1)
* 5907475 Circuit board system having a mounted board and a plurality of mounting boards 23 1996
 
SANDISK TECHNOLOGIES LLC (2)
* 2015/0261,265 Self-Supporting Thermal Tube Structure for Electronic Assemblies 2 2014
* 2015/0261,266 Thermal Isolation Techniques 3 2014
 
ORACLE INTERNATIONAL CORPORATION (1)
* 2012/0188,708 THERMAL AND POWER BUS STACKED PACKAGE ARCHITECTURE 2 2011
 
ROBERT BOSCH GMBH (1)
* 2014/0362,535 TRANSMISSION CONTROL MODULE 2 2012
 
ATI TECHNOLOGIES ULC (1)
* 2013/0343,000 THERMAL MANAGEMENT CIRCUIT BOARD FOR STACKED SEMICONDUCTOR CHIP DEVICE 4 2012
 
SUNPOWER CORPORATION (1)
* 2015/0342,084 Serviceable Electrical Box Thermal Management 1 2015
 
The United States of America as represented by the Secretary of the Air Force (1)
* 6930386 Shock hardened mounting and cooling of a semiconductor device 3 2004
 
ADVANTEST CORPORATION (1)
* 2006/0245,166 Using a leaf spring to attach clamp plates with a heat sink to both sides of a component mounted on a printed circuit assembly 1 2005
 
SAMSUNG SDI CO., LTD. (1)
* 2008/0218,979 Printed circuit (PC) board module with improved heat radiation efficiency 1 2007
* Cited By Examiner

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