Semiconductor device mounting method

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United States of America Patent

PATENT NO 9793221
SERIAL NO

15009969

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Abstract

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A first insulating film is applied onto a joining face of a semiconductor device including a connection terminal on a joining face, and the connection terminal is embedded inside the first insulating film. The second insulating film is formed on a joining target face of a joining target, which includes a connection target terminal on the joining target face, and the connection target terminal is embedded inside the second insulating film. The semiconductor device and the joining target are joined together by applying pressure and causing the semiconductor device and the joining target to make contact with each other.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
FUJITSU LIMITEDKAWASAKI17796

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kainuma, Norio Nagano, JP 57 226
Kira, Hidehiko Nagano, JP 89 314
Kubota, Takashi Chikuma, JP 144 901
Masuyama, Takumi Kawasaki, JP 9 2

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