Semiconductor device mounting method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9793221
APP PUB NO 20160284566A1
SERIAL NO

15009969

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Importance

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Abstract

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A first insulating film is applied onto a joining face of a semiconductor device including a connection terminal on a joining face, and the connection terminal is embedded inside the first insulating film. The second insulating film is formed on a joining target face of a joining target, which includes a connection target terminal on the joining target face, and the connection target terminal is embedded inside the second insulating film. The semiconductor device and the joining target are joined together by applying pressure and causing the semiconductor device and the joining target to make contact with each other.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
FUJITSU LIMITEDKAWASAKI18047

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Cited Art Landscape

Patent Info (Count) # Cites Year
 
SONY CORPORATION (1)
* 2013/0009,321 SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS 18 2012
 
OLYMPUS CORPORATION (1)
* 2011/0249,106 IMAGE PICKUP APPARATUS, ENDOSCOPE AND MANUFACTURING METHOD FOR IMAGE PICKUP APPARATUS 14 2011
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (2)
* 2014/0117,546 HYBRID BONDING MECHANISMS FOR SEMICONDUCTOR WAFERS 13 2012
* 2015/0294,955 Stacked Semiconductor Structure and Method 1 2014
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
* 2012/0225,522 Package 3D Interconnection and Method of Making Same 23 2012
* Cited By Examiner

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